Mini Stencils / Rework Stencils
Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and aperture sizes used in the original production stencil. Stentech mini stencils come with holders and squeegee blades, used for placing solder paste on the pads of components being reworked.
Stentech has the capability of creating rework stencils for all types of components, from BGAs to BLAH, using either Gerber data or mechanical drawings.
Our mini stencil design is flexible enough to operate with a dedicated BGA rework system, as well as for use in manual printing.
Stentech's mini stencils have been designed for optimum stability and flatness and cannot contaminate surrounding areas. We use side reinforcements to prevent side to side shift and front ramps to prevent solder paste spillage.
All of our mini stencils are provided with custom squeegee blades fabricated to precisely fit the particular mini stencil. Identification is cut onto the side of the stencil.
Other uses for mini stencils:
IC and QFP rework
Heat-sink Epoxy Application
Short Runs for Small Prototypes
2nd Assembly Thru-hole Reflow.
Flat plates or Flat plates mounted onto a mini frame are also available. These would be used when the board has a lot of space around the components.
Print On Component (POC) Mini Stencil
Designed specifically to work with most of the automated rework systems on the market, the Print Part System is used to print paste directly on the component and then fit into your own rework setup for pick-up, inspection, and replacement.